Transient cooling of thermoelectric coolers and its applications for microdevices

نویسندگان

  • Ronggui Yang
  • Gang Chen
  • Ravi Kumar
  • Jeffrey Snyder
  • Jean-Pierre Fleurial
چکیده

If a current pulse with a magnitude several times higher than the steady state optimum current is applied to a thermoelectric cooler, an instantaneously lower temperature than that reachable at the steady state can be obtained. Most previous studies of this transient cooling effect focus on the minimum temperature achievable for free standing thermoelectric (TE) elements. In this work, we systematically study the transient response of thermoelectric coolers with and without mass loads through examination of both the minimum temperature reached and the time constants involved in the cooling and the recovering stages. For integrated thermoelectric cooler-passive mass load systems, two distinguishable cooling regimes, uniform cooling and interfacial cooling, are identified, and the criterion for utilization of the transient cooling effect is established based on the time constants. Although the results of this work are generally applicable, the discussions are geared towards cooling of microdevices that are of current interests. 2004 Elsevier Ltd. All rights reserved.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

WeE1-1 : A Simple and Intuitive Graphical Approach to the Design of Thermoelectric Cooling Systems

In various applications, thermoelectric active cooling systems can help maintain electronic devices at a desired temperature condition better than passive coolers. Thermoelectric Coolers (TEC) are especially useful when the temperature of a device needs to be precisely controlled. This study proposes a user-friendly graphical method for calculating the steady-state operational point of a TEC ba...

متن کامل

On-chip Hot Spot Remediation with Miniaturized Thermoelectric Coolers

The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in chip heat flux and growing concern over the emergence of onchip “hot spots” in microprocessors, along with such high flux regions in power electronic chips and LED’s. Miniaturized thermoelectric coolers (μ-TEC’s) are a most promising cooling technique for th...

متن کامل

Array of Thermoelectric Coolers for On-Chip Thermal Management

Site-specific on-demand cooling of hot spots in microprocessors can reduce peak temperature and achieve a more uniform thermal profile on chip, thereby improve chip performance and increase the processor’s life time. An array of thermoelectric coolers (TECs) integrated inside an electronic package has the potential to provide such efficient cooling of hot spots on chip. This paper analyzes the ...

متن کامل

N- AND P-TYPE SiGe/Si SUPERLATTICE COOLERS

SiGe is a good thermoelectric material for high temperature applications. In this paper the fabrication and characterization of single-element SiGe/Si superlattice coolers of both nand p-type devices are described for room temperature applications. Superlattice structures were used to enhance the device performance by reducing the thermal conductivity between the hot and the cold junctions, and...

متن کامل

MODELING AND OPTIMIZATION OF SINGLE-ELEMENT BULK SiGe THIN-FILM COOLERS

Modeling and optimization of bulk SiGe thin-film coolers are described. Thin-film coolers can provide large cooling power densities compared to commercial thermoelectrics. Thin-film SiGe coolers have been demonstrated with maximum cooling of 4◦C at room temperature and with cooling power density exceeding 500 W/cm2. Important parameters in the design of such coolers are investigated theoretical...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2005